UAT to expand wafer capacity

Jul-30th-2010

SAN JOSE: Unisem Advanced Technologies (UAT) has announced plans to spread out its wafer bumping capacity at its factory in Ipoh, Malaysia. UAT, which is a joint venture of Unisem, FlipChip International and AdvanPack Solutions, is a hew packing and test facility.

According to details released in the declaration, the floor space at the Malaysian bumping facility will be increased by 100 percent. Sources say that the equipment to help the stretch will be in place and available for use in September 2010.

Also interpret: AUO to pocket silicon wafer firm M.Setek

The company says that they overwhelming requirement from customers for wafer bumping during the upsurge in the persistence gives them the impetus to go in for such an extent.